|  | 
      
        |  | WPL  Board Size     560mm x 640mm  | 
      
        |  |  | 
      
        |  | Finish Thickness      0.3~3.5mm  | 
      
        |  |  | 
      
        |  | PCB Layer Count     2~16 Layers  | 
      
        |  |  | 
      
        |  | Finish Copper     HOZ~6OZ  | 
      
        |  |  | 
      
        |  | Aspect Ratio      10:1 | 
      
        |  |  | 
      
        |  | Impedance Requirement      90~100∮10%  | 
      
        |  |  | 
      
        |  | the Tolerance of Board Thickness  ∮10%  | 
      
        |  |  | 
      
        |  | Min Finish Hole      0.15mm Laser 0.075mm  | 
      
        |  |  | 
      
        |  | Hole Position Alignment Extent       ∮2mil  | 
      
        |  |  | 
      
        |  | Min Trace / Gap of inner  layer/ Gap of inner layer    3/3mil | 
      
        |  |  | 
      
        |  | Min Trace / Gap of outer layer   3/3mil | 
      
        |  |  | 
      
        |  | Min Ring size        4mil  | 
      
        |  |  | 
      
        |  | Min. S/M Opening ( One Sided )    2mil | 
      
        |  |  | 
      
        |  | Min Solder Bridge Design    2mil  | 
      
        |  |  | 
      
        |  | Plug Hole Size    ∝0.7mm  | 
      
        |  |  | 
      
        |  | Thickness of Gold Plating    2 ~ 40"  | 
      
        |  |  | 
      
        |  | the thickness of immersion Gold   2~8u"  | 
      
        |  |  | 
      
        |  | Width/Height of Silkscreen      5mil/25mil | 
      
        |  |  | 
      
        |  | the Tolerance of  CNC/PUNCH    ∮0.1mm  | 
      
        |  |  | 
      
        |  | O/S Test Conditon      50-300V1M-100M  | 
      
        |  |  | 
      
        |  | CAM Operation System    Orbotech GenesisCAM350  | 
      
        |  |  | 
      
        |  | surface finish  ENIG Immersion Silver Immersion TinHASL OSP, Gold Finger etc | 
      
        |  |  | 
      
        |  | Base Material   CEM-3FR-4HFHigh TgAl laminatecopper laminateTeflon,etc |